<img height="1" width="1" style="display:none;" alt="" src="https://dc.ads.linkedin.com/collect/?pid=237593&amp;fmt=gif">
slide-1.jpg

DFS Blog

LP_header_dfs_1067x138.png


Precision Slurry Composition in Chemical Mechanical Planarization

Posted by Karl Urquhart on Mar 26, 2018 11:55:17 AM

Precise Slurry Requirements Increase CMP Process Windows but Necessitate greater dependence on Inline Metrology

Chemical Mechanical Planarization or Polishing (CMP) is the method of using chemical slurry formulations with mechanical polishing-pad-action to flatten conductive or dielectric materials on silicon wafers in semiconductor manufacturing.

The end goal is to achieve a flat enough surface aspect ratio as required by photolithography steps, where layers of integrated circuits are layered step by step. 

Read More

Topics: cmp process, chemical mechanical planarization, process control

5 Key Benefits of DFS' ACvFLO Gas Delivery Systems

Posted by DFS on Feb 15, 2018 4:05:00 PM

DFS  ACvFLO Gas Delivery Systems Set a new standard in Gas Cabinet Technology

To serve today’s Semiconductor gas market; DFS employs advanced technical knowledge, build capacity, and programming expertise to develop game-changing gas delivery systems. 

The ACvFLO High Purity Gas Delivery System has advanced functionality and capabilities not seen in the Semiconductor industry to date.

These advancements include an open, fully integrated PLC and HMI panel, with connectivity and networkability, operational sequences, and automated pressure control.

Read More

Topics: process control, gas delivery systems

This CMP Slurry Blender Sets the Bar for Process Control

Posted by DFS on Oct 19, 2017 4:24:58 PM

Preparing a DFS High-Purity CMP Slurry Blender For Delivery

Diversified Fluid Solutions recently completed work on a precision slurry blender which increases overall production capacity and process control.

Through advancements in our proprietary blending technology, the fully-automated Fusion™ Slurry Blender eliminates deadlegs in the flow path of the slurry while managing loop pressure control to +/- 0.3 psi.

The end result is improved yields, process control and repeatability across the board.

Read More

Topics: fluid management systems, process control, slurry blender