DFS Team Called In To Improve Accuracy, Reduce Waste, and Increase ThroughPut on Legacy Chemical Blenders
Lead by a three man team made up of a PLC Programmer, and (2) Field Service Technicians, DFS was able to complete an insitu, on-site upgrade to a client's existing OEM chemical blender systems. The upgrade came as a result of a request from a large semiconductor manufacturer, inquiring if DFS could do anything to improve their existing OEM chemical blender performance.
DFS Announces New FusionTM On-DemandTM Mobile Chemical Blender
Designed for one of our newest customers in New Mexico, the DFS FusionTM On-DemandTM Mini Mix is engineered to transfer chemical from an interchangeable 5 gallon Pail and bulk supply to the internal On-Demand Blender.
Chemical 1 is supplied via the internal vessel. UPW, and Chemical 2 are supplied via the house supply source.
Versatile On-Demand Chemical Blender is a Big Hit with Semiconductor Manufacturer
DFS recently developed and released a compact SC-1, 3 part blender, for a large Semiconductor Manufacturer. The Standard Clean Solution #1 (SC-1) process involves a sequence of cleaning steps using “standard” solutions and employs a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), and DI water (H2O). The system enables recipe customization through an HMI with verified authorization.
Precise control of chemical composition through use of on-site chemical blending and mixing systems improves overall IC process yield.
This is accomplished by providing more consistent quality of materials that come into contact with the wafer and its forming circuits.
On-site blending results in tighter assay control, higher purity, and lower particles. On-site blenders also allow users to test materials suppliers for comparison to optimize ROI and control cost.
Uses and Benefits of Mobile Chemical Blending Systems (MCBS)
A given factory's chemical formulations are pushed to: 1) improve affordability, while 2) requiring higher process performances in critical areas. One way to accomplish both goals is to target incoming chemical solutions that are high in concentrations and complexity.
Achieving the proper dilution and high performance in current and upcoming process nodes requires complex blends of organic and inorganic compounds in CMP slurry formulations. The combinations of all these factors result in products that have nuanced mixing and handling requirements.
Precise Slurry Requirements Increase CMP Process Windows but Necessitate greater dependence on Inline Metrology
Chemical Mechanical Planarization or Polishing (CMP) is the method of using chemical slurry formulations with mechanical polishing-pad-action to flatten conductive or dielectric materials on silicon wafers in semiconductor manufacturing.
The end goal is to achieve a flat enough surface aspect ratio as required by photolithography steps, where layers of integrated circuits are layered step by step.
Characterization and importance of chemical mix uniformity, precision, and preservation of purity levels to reduce cost, prevent rework/scrap, and increase Process yield overall.
Manufacturers place a great deal of emphasis on cost reduction, prevention of rework or scrap, and increasing overall process yield. One result has been a rise in precision and control technology innovations geared towards process chemicals uniformity.
Many focus on individual aspects of metrology for quantitative, or qualitative determination, either by off-line or inline methods, with the intent to achieve the highest productivity at the lowest cost.