<img height="1" width="1" style="display:none;" alt="" src="https://dc.ads.linkedin.com/collect/?pid=237593&amp;fmt=gif">

DFS Blog

DFS Presents with KxS at 2022 International Conference on Planarization Technology (ICPT)

Posted by DFS on Sep 28, 2022 6:59:35 AM

Slurry Delivery Systems Defining Incoming CMP Slurry Density and Achieving Target Process Concentration Driven by Inline Metrology

Diversified Fluid Solutions and KxS Technologies jointly presented at the 2022 International Conference on Planarization Technology (ICPT) in Portland, Oregon this week. DFS provides ultra-high-purity gas, chemical distribution and blending systems for the semiconductor industry. KxS Technologies designs and manufactures cutting-edge inline chemical concentration monitors based on refractive index.

The joint presentation by DFS and KxS described the need for, and ability of the presented slurry delivery system to achieve tight incoming slurry density and target UPW dilutions via inline metrology.

Read More

Topics: cmp process, chemical mechanical planarization

CMP Slurry Blending with Closed-Loop Real-Time Control & Monitoring

Posted by DFS on Jul 23, 2021 9:02:53 AM

Remove Expensive Labor-Intensive Offline Metrologies and Manual Process Adjustments

DFS recently completed a process characterization and successfully developed onboard control technology that allows for closed-loop control of a customer-specific semiconductor cmp slurry solution in a blend and distribution operation.

Read More

Topics: process control, chemical mechanical planarization, chemical blending, chemical blender

DFS Presents in CMP User Group Conference

Posted by DFS on Oct 16, 2018 5:23:59 PM

Highlights From the International Conference On Planarization/CMP Technology (ICPT) 

Karl Urquhart and our Korea licensee SB-TECH present Real Time Process Monitoring in CMP, Post CMP Clean Blending and Distribution Applications at the ICPT 2018, October, 15-17, 2018, Seoul, Republic of Korea.

Read More

Topics: process control, chemical mechanical planarization

Precision Slurry Composition in Chemical Mechanical Planarization

Posted by Karl Urquhart on Mar 26, 2018 11:55:17 AM

Precise Slurry Requirements Increase CMP Process Windows but Necessitate greater dependence on Inline Metrology

Chemical Mechanical Planarization or Polishing (CMP) is the method of using chemical slurry formulations with mechanical polishing-pad-action to flatten conductive or dielectric materials on silicon wafers in semiconductor manufacturing.

The end goal is to achieve a flat enough surface aspect ratio as required by photolithography steps, where layers of integrated circuits are layered step by step. 

Read More

Topics: process control, chemical mechanical planarization