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Precision Slurry Composition in Chemical Mechanical Planarization

Posted by Karl Urquhart on Mar 26, 2018 11:55:17 AM

Precise Slurry Requirements Increase CMP Process Windows but Necessitate greater dependence on Inline Metrology

Chemical Mechanical Planarization or Polishing (CMP) is the method of using chemical slurry formulations with mechanical polishing-pad-action to flatten conductive or dielectric materials on silicon wafers in semiconductor manufacturing.

The end goal is to achieve a flat enough surface aspect ratio as required by photolithography steps, where layers of integrated circuits are layered step by step. 

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Topics: process control, cmp process, chemical mechanical planarization, semiconductor manufacturing