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CMP Slurry Blending with Closed-Loop Real-Time Control & Monitoring

Posted by DFS on Jul 23, 2021 9:02:53 AM

Remove Expensive Labor-Intensive Offline Metrologies and Manual Process Adjustments

DFS recently completed a process characterization and successfully developed onboard control technology that allows for closed-loop control of a customer-specific semiconductor cmp slurry solution in a blend and distribution operation.

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Topics: Semiconductor, process control, chemical mixing and blending, chemical mechanical planarization, chemical blending, chemical blender

DFS Presents in CMP User Group Conference

Posted by DFS on Oct 16, 2018 5:23:59 PM

Highlights From the International Conference On Planarization/CMP Technology (ICPT) 

Karl Urquhart and our Korea licensee SB-TECH present Real Time Process Monitoring in CMP, Post CMP Clean Blending and Distribution Applications at the ICPT 2018, October, 15-17, 2018, Seoul, Republic of Korea.

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Topics: process control, chemical mechanical planarization

Precision Slurry Composition in Chemical Mechanical Planarization

Posted by Karl Urquhart on Mar 26, 2018 11:55:17 AM

Precise Slurry Requirements Increase CMP Process Windows but Necessitate greater dependence on Inline Metrology

Chemical Mechanical Planarization or Polishing (CMP) is the method of using chemical slurry formulations with mechanical polishing-pad-action to flatten conductive or dielectric materials on silicon wafers in semiconductor manufacturing.

The end goal is to achieve a flat enough surface aspect ratio as required by photolithography steps, where layers of integrated circuits are layered step by step. 

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Topics: process control, chemical mechanical planarization

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