DFS recently completed a process characterization and successfully developed onboard control technology that allows for closed-loop control of a customer-specific semiconductor cmp slurry solution in a blend and distribution operation.
Topics: process control, chemical mechanical planarization, chemical blending, chemical blender
Chemical Mechanical Planarization or Polishing (CMP) is the method of using chemical slurry formulations with mechanical polishing-pad-action to flatten conductive or dielectric materials on silicon wafers in semiconductor manufacturing.
The end goal is to achieve a flat enough surface aspect ratio as required by photolithography steps, where layers of integrated circuits are layered step by step.