---
title: Blog | Media Supply | Exentec | chemical mechanical planarization
description: chemical mechanical planarization | Explore our latest UHP gas and chemical blending and delivery systems updates, insights and innovations.
---

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## [CMP Slurry Blending with Closed-Loop Real-Time Control & Monitoring](https://blog.cpsgrp.com/dfsolution/cmp-slurry-blending-with-closed-loop-real-time-control)

 Posted by [DFS](https://blog.cpsgrp.com/dfsolution/author/dfs) on Jul 23, 2021 9:02:53 AM

[![](https://blog.cpsgrp.com/hubfs/CPSGrp_Feb2017/_Home/3%20blog%20images/DFS%20(HP%20Gas%20Gary)/dfs-fusion-chemical-blender.gif)](https://blog.cpsgrp.com/dfsolution/cmp-slurry-blending-with-closed-loop-real-time-control)

### Remove Expensive Labor-Intensive Offline Metrologies and Manual Process Adjustments

DFS recently completed a process characterization and successfully developed onboard control technology that allows for closed-loop control of a customer-specific semiconductor cmp slurry solution in a blend and distribution operation.

[Read More](https://blog.cpsgrp.com/dfsolution/cmp-slurry-blending-with-closed-loop-real-time-control)

Topics: [process control](https://blog.cpsgrp.com/dfsolution/topic/process-control), [chemical mechanical planarization](https://blog.cpsgrp.com/dfsolution/topic/chemical-mechanical-planarization), [chemical blending](https://blog.cpsgrp.com/dfsolution/topic/chemical-blending), [chemical blender](https://blog.cpsgrp.com/dfsolution/topic/chemical-blender)

## [Precision Slurry Composition in Chemical Mechanical Planarization](https://blog.cpsgrp.com/dfsolution/precision-slurry-composition-in-chemical-mechanical-planarization)

 Posted by [Karl Urquhart](https://blog.cpsgrp.com/dfsolution/author/karl-urquhart) on Mar 26, 2018 11:55:17 AM

[![](https://blog.cpsgrp.com/hubfs/CPSGrp_Feb2017/_Home/3%20blog%20images/DFS%20(HP%20Gas%20Gary)/No%20Blind%20CMP.png)](https://blog.cpsgrp.com/dfsolution/precision-slurry-composition-in-chemical-mechanical-planarization)

# **Precise Slurry Requirements Increase CMP Process Windows but Necessitate greater dependence on Inline Metrology**

Chemical Mechanical Planarization or Polishing (CMP) is the method of using chemical slurry formulations with mechanical polishing-pad-action to flatten conductive or dielectric materials on silicon wafers in semiconductor manufacturing.

The end goal is to achieve a flat enough surface aspect ratio as required by photolithography steps, where layers of integrated circuits are layered step by step. 

[Read More](https://blog.cpsgrp.com/dfsolution/precision-slurry-composition-in-chemical-mechanical-planarization)

Topics: [process control](https://blog.cpsgrp.com/dfsolution/topic/process-control), [chemical mechanical planarization](https://blog.cpsgrp.com/dfsolution/topic/chemical-mechanical-planarization)

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