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DFS Blog

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Karl Urquhart Presents CMP Process Monitoring Report at Semicon China

Posted by DFS on Apr 8, 2019 3:15:32 PM

Excerpt From "Real Time Process Monitoring in CMP" Given at Semicon China

In today’s industry, chemical uniformity and quality play major roles in defect reduction and overall supply-chain costs. While there have been major advances in metrology in recent years, they tend to vary in many areas and principles, and none are a fit for all solutions.

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Topics: cmp process, semicon china

DFS Presents in CMP User Group Conference

Posted by DFS on Oct 16, 2018 5:23:59 PM

Highlights From the International Conference on Planarization/CMP Technology (ICPT)

Karl Urquhart and our Korea licensee SB-TECH present Real Time Process Monitoring in CMP, Post CMP Clean Blending and Distribution Applications at the ICPT 2018, October, 15-17, 2018, Seoul, Republic of Korea.

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Topics: cmp process

Mobile Chemical Blending Systems (MCBS) Help Overcome the Challenges of Next-Generation Chemicals

Posted by Karl Urquhart on Apr 12, 2018 2:10:49 PM

Uses and Benefits of Mobile Chemical Blending Systems (MCBS) 

A given factory's chemical formulations are pushed to: 1) improve affordability, while 2) requiring higher process performances in critical areas. One way to accomplish both goals is to target incoming chemical solutions that are high in concentrations and complexity.

Achieving the proper dilution and high performance in current and upcoming process nodes requires complex blends of organic and inorganic compounds in CMP slurry formulations. The combinations of all these factors result in products that have nuanced mixing and handling requirements.

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Topics: cmp process, chemical blending, semiconductor manufacturing

Precision Slurry Composition in Chemical Mechanical Planarization

Posted by Karl Urquhart on Mar 26, 2018 11:55:17 AM

Precise Slurry Requirements Increase CMP Process Windows but Necessitate greater dependence on Inline Metrology

Chemical Mechanical Planarization or Polishing (CMP) is the method of using chemical slurry formulations with mechanical polishing-pad-action to flatten conductive or dielectric materials on silicon wafers in semiconductor manufacturing.

The end goal is to achieve a flat enough surface aspect ratio as required by photolithography steps, where layers of integrated circuits are layered step by step. 

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Topics: process control, cmp process, chemical mechanical planarization, semiconductor manufacturing