DFS recently developed and released a compact SC-1, 3 part blender, for a large Semiconductor Manufacturer. The Standard Clean Solution #1 (SC-1) process involves a sequence of cleaning steps using “standard” solutions and employs a mixture of ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), and DI water (H2O). The system enables recipe customization through an HMI with verified authorization.
The SC-1 solution is the best known treatment for removing particles from the surface of the wafer. It is also very effective at removing organic contaminants and some metallic contaminants from the surface of the wafer.
Our semiconductor manufacturing customer was so happy they immediately ordered a second unit.
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